In April of this year, Honor Play4T was released with a 6.39-inch display and a solution to recognize fingerprints on the back. However, this smartphone is equipped with the Huawei HiSilicon Kirin 710A SoC. According to the “Technology Board Daily” report, this “Kirin 710A” mobile chip starts mass production and uses the SMIC 14 nm process. This chip clocks at 2.0 GHz, which means that it is a frequency deterioration compared to Kirin 710. "Kirin 710A" represents a breakthrough in achieving zero localization and is an icebreaking step for China's semiconductor chip technology.  Recall that Huawei is currently TSMC's second largest customer after Apple. However, orders from TSMC can decrease significantly, especially if other foundries step up their game. Huawei is slowly shifting its orders from TSMC and starting with the Kirin 710A. Huawei has no problem with TSMC, but TSMC is now a target for the U.S. government.
Huawei is therefore preparing in good time. Although a Taiwanese company, TSMC uses American technology in its manufacturing process. There is speculation that the American government is seeking a ban on TSMC that would limit the use of American technology on Huawei chips.
HONOR Play 4T with Kirin 710A specifications
- 6.39-inch IPS (720 x 1560 pixels) Capacitive LCD touchscreen
- Octa-core Kirin 710A 12 nm processor (4 × 2.2 GHz Cortex-A73 and 4 × 1.7 GHz Cortex-A53) with ARM Mali-G51 MP4-GPU
- 6 GB RAM with 128 GB memory, expandable memory up to 256 GB with microSD
- Android 10, Magic UI 3 , no Google Play Services
- 48-megapixel rear-view camera with 1: 1.8 aperture, LED flash, 8-megapixel ultra-wide sensor with 1: 2.4 aperture, 2 MP depth camera with 1: 2.4 aperture
- 8MP front camera HDR and 1080p at 30 fps
- Dimensions: 159.8 x 76.1 x 8.1 mm; Weight: 176 g
- Fingerprint sensor on the back
- Dual 4G VoLTE, Wi-Fi 802.11 AC (2.4 GHz + 5 GHz), Bluetooth 5.0 LE, GPS + GLONASS, USB Type C
- 4000 mAh (typical) / 3900mAh (minimum) battery with 10W quick charge